Multi-modal data analysis for defect identification
US8260034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2008 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A technique for identifying a defect in an object produced by a controllable process. A first type of data generated as a result of production of the object by the controllable process is obtained. A second type of data generated as a result of production of the object by the controllable process is obtained. The first type of data and the second type of data are jointly analyzed. A defect is identified in the object based on the joint analysis of the first type of data and the second type of data. By way of example, the controllable process comprises a semiconductor manufacturing process such as a silicon wafer manufacturing process and the object produced by the semiconductor manufacturing process comprises a processed wafer. The first type of data comprises tool trace data and the second type of data comprises wafer image data. The tool trace data is generated by a photolithographic tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.