Underfilling of pre-molded components
US8261443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Feb 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
During assembly of a medical electrical lead, the tubular lead component is slid over the outer surface of the lead body to a desired location on the lead. The ends of the tubular lead body are sealed and a space is defined between the inner surface of the tubular lead component and the outer surface of the lead body. Medical adhesive is injected through the port(s) to substantially fill the space between the tubular component and the lead body. The adhesive is then cured. Any ports extending away from the sleeve are removed after the curing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.