Patent · US Active

Underfilling of pre-molded components

US8261443B2 · kind B2 · utility

0Cited by
7References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 3, 2009
Grant dateSep 11, 2012
Priority date
Expiry dateFeb 10, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4922
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

During assembly of a medical electrical lead, the tubular lead component is slid over the outer surface of the lead body to a desired location on the lead. The ends of the tubular lead body are sealed and a space is defined between the inner surface of the tubular lead component and the outer surface of the lead body. Medical adhesive is injected through the port(s) to substantially fill the space between the tubular component and the lead body. The adhesive is then cured. Any ports extending away from the sleeve are removed after the curing step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.