Handling tools for components, in particular eletronic components
US8262146B2 · kind B2 · utility
6Cited by
9References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 4, 2007 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Oct 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A handling tool for electronic components includes a holding opening, to which a vacuum pressure may be applied and at which components to be handled are able to be held via vacuum pressure. At least one counter support, which outwardly projects beyond the opening plane in an operating position, is situated inside the holding opening. The component held by vacuum pressure is supported in the region of its surface acted upon by vacuum pressure, in such a way that this same surface bends concavely when viewed from the side of the vacuum pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.