Carrier structure for mounting LED chips
US8262254B2 · kind B2 · utility
0Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Sep 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.