High reliability cooling system for LED lamps using dual mode heat transfer loops
US8262263B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Nov 16, 2008 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Oct 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8586
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one aspect, a cooling device for an LED chip mounted on a heat sink includes an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink. In another aspect, an apparatus includes a heat sink, an LED chip mounted on the heat sink, and an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.