Etchant and method of manufacturing an array substrate using the same
US8262928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6743
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH4)2S2O8, about 0.1 percent by weight to about 10 percent by weight of an inorganic acid, about 0.1 percent by weight to about 10 percent by weight of an acetate salt, about 0.01 percent by weight to about 5 percent by weight of a fluorine-containing compound, about 0.01 percent by weight to about 5 percent by weight of a sulfonic acid compound, about 0.01 percent by weight to about 2 percent by weight of an azole compound, and a remainder of water. Accordingly, the etchant may have high stability to maintain etching ability. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.