Nanostructured dielectric materials for high energy density multi layer ceramic capacitors
US8263515B2 · kind B2 · utility
6Cited by
5References
19Claims
0Family size
Inventor
Key dates
| Filing date | Aug 29, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Dec 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/266
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high energy density multilayer ceramic capacitor, having at least two electrode layers and at least one substantially dense polycrystalline dielectric layer positioned therebetween. The at polycrystalline dielectric layer has an average grain size of less than about 300 nanometers, a particle size distribution of between about 150 nanometers and about 3 micrometers, and a maximum porosity of about 1 percent. The dielectric layer is selected from the group including TiO2, BaTiO3, Al2O3, ZrO2, lead zirconium titanate, and combinations thereof and has a breakdown strength of at least about 1100 kV per centimeter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.