Hot melt pressure sensitive adhesives for paper labels
US8263696B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31902
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A HMPSA is provided that preferably includes at least a) from 30 to 50% of a mixture of triblock and diblock styrenic copolymers having an overall styrene content comprised between 14 and 40%, b) from 40 to 55% of a tackifying resin with a softening temperature comprised between 70 and 150° C. obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms; c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%; d) from 1 to 6% of a filler selected among calcium carbonate or a low molecular weight homopolymer or copolymer of polyethylene. A laminated system is also provided that includes at least an adhesive layer utilizing the HMPSA and paper facestock. Also included are PSA labels obtainable from the laminated system with a reduced tendency to discolor after storage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.