Backlit key assembly having a reduced thickness
US8263887B2 · kind B2 · utility
57Cited by
13References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Sep 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2233/002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backlit key assembly having a reduced thickness for an electronic device, and an electronic device having such a backlit key assembly are provided. The key assembly utilizes a local sink (recess) in a backing plate of the key assembly to lower the light source (e.g. LED) and flexible printed circuit board relative to the backing plate. The key assembly described herein provides a suitable leading space for the light source while permitting the overall thickness of the key assembly to be reduced compared with conventional backlit key designs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.