LED package
US8263994B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Nov 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
Abstract
A LED package includes a substrate, at least one LED chip, a transparent adhesive and a lens. The at least one LED chip is mounted on the substrate. The transparent adhesive is filled between the LED chip and the lens. A number of through holes is regularly defined in an optical non-effective portion of the lens. The through holes are configured for increasing the air convection between inside and outside of the lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.