Semiconductor device including a magnetic tunnel junction and method of manufacturing the same
US8264053B2 · kind B2 · utility
7Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Feb 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B61/22
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
To provide a semiconductor device that has an improved adhesion between a bottom conductive layer and a protection film protecting an MTJ element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.