Device and system for measuring material thickness
US8264129B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jul 21, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0258
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.