Heat sink and laser diode
US8264841B2 · kind B2 · utility
6Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2008 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Nov 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.