Electronic device package with connection terminals including uneven contact surfaces
US8264850B2 · kind B2 · utility
3Cited by
27References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jun 30, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.