Bonding system for optical alignment
US8265436B2 · kind B2 · utility
9Cited by
5References
24Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Sep 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8114
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.