Three-dimensional macro-chip including optical interconnects
US8267583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2009 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Jul 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.