PCB droplet actuator fabrication
US8268246B2 · kind B2 · utility
106Cited by
189References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2008 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Nov 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Alternative approaches to fabricating printed circuit boards for use in droplet actuator operations are provided. In one embodiment, a method of manufacturing a droplet actuator for conducting droplet operations includes positioning a dielectric material between a first metal layer configured to include an electrode and a second metal layer configured to include an interconnect pad. The method additionally includes forming a connection between the first and second metal layers. Droplet actuators and methods of fabricating and supporting printed circuit boards of droplet actuators are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.