Patent · US Active

Heat aging resistant polyamides

US8268920B2 · kind B2 · utility

7Cited by

25References

14Claims

0Family size

Assignee

BASF SE

Inventors

Manoranjan Prusty · Mannheim, DE
Philippe Desbois · Maikammer, DE
Matthias Scheibitz · Weinheim, DE
Martin Baumert · Dossenheim, DE

Key dates

Filing date	Dec 10, 2009
Grant date	Sep 18, 2012
Priority date	—
Expiry date	Dec 10, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/03
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.