Method for the production of MOS transistors

US8269276B2 · kind B2 · utility

Assignee

• STMICROELECTRONICS, INC. · US

Inventor

• Stefan Guenther · Lake Orion, US

Key dates

• Filing date: Mar 29, 2010
• Grant date: Sep 18, 2012
• Expiry date: Mar 29, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/856

Abstract

The invention relates to a method for the production of both MOS transistors with extremely low leakage currents at the pn junctions and logic/switching transistors, whose gates are laterally defined by spacers in a p-substrate or a p-well in an n-substrate. The aim of the invention is to provide a method for the production of MOS transistors with extremely low leakage currents that allows for parallel logic/switching transistors. This is achieved by initially carrying out an LDD ion implantation via the edges of the gates in order to form an LDD region and subsequently removing the spacers by means of an anisotropic etching step exhibiting high selectivity in relation to the gate and substrate materials, including the covering layers thereof, or by covering the MOS transistors with an extremely low leakage currents prior to isotropic spacer production such that the spacers are formed exclusively on the edges of the gates of the logic/switching transistors, while the MOS transistors with an extremely low leakage current always remain connected solely via the LDD region, and there is no high dose implantation in the S/D regions of these MOS transistors with extremely low leakage cur…