Semiconductor module and camera module mounting said semiconductor module
US8269298B2 · kind B2 · utility
5Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2010 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Dec 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.