Semiconductor device having improved heat dissipation capabilities
US8269338B2 · kind B2 · utility
1Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Aug 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.