High frequency module for filling level measurements in the W-band
US8269666B2 · kind B2 · utility
3Cited by
29References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2009 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Sep 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-frequency module is for fill level measuring and for use at frequencies of more than 75 GHz. The high-frequency module comprises a microwave semiconductor, a printed circuit board and a housing bonded to the printed circuit board. In order to reduce the power required, operation of the microwave semiconductor takes place in a pulsed manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.