Thermal dissipation for imager head assembly of remote inspection device
US8269828B2 · kind B2 · utility
9Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2008 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Jan 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imager head assembly for a remote inspection device includes an imager housing. A circuit board is positioned within the imager housing. The circuit board has a light emitting diode connected thereto. A thermally conductive material in contact with the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing. A light transmissive light pipe unit can be positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.