Cooling arrangement for a rack mounted processing device
US8270171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2010 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Jul 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.