Resin injection mold
US8272865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2009 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Apr 15, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold includes a cavity mold and a core mold and is produced on a base plate by metal photofabrication. The cavity mold is provided with a cavity warm water circuit for allowing warm water for heating to flow and a cavity cold water circuit for allowing cold water for cooling to flow. The core mold is also provided with a core warm water circuit and a core cold water circuit. The core mold includes an air blowing passage for feeding warm air or cold air into a resin molding part and a suction passage (36) for sucking a gas within the resin molding part. The resin molding part side of the air blowing passage and the suction passage is formed of a low-density shaping part that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part, whereby rapid heating or cooling of the resin injection molding mold can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.