Sputter target utilization
US8273221B2 · kind B2 · utility
6Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Sep 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/347
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method are provided for improved utilization of a sputter target in the longitudinal end regions. The focus of erosion in the end regions is widened, thereby extending the useful life of the target. This provides improved efficiency and reduces waste because a greater proportion of the target material in the more expansive central region can be harvested, because the target is utilized for a longer period of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.