Patent · US Active

Sputter target utilization

US8273221B2 · kind B2 · utility

6Cited by
8References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 13, 2006
Grant dateSep 25, 2012
Priority date
Expiry dateSep 20, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/347
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An apparatus and method are provided for improved utilization of a sputter target in the longitudinal end regions. The focus of erosion in the end regions is widened, thereby extending the useful life of the target. This provides improved efficiency and reduces waste because a greater proportion of the target material in the more expansive central region can be harvested, because the target is utilized for a longer period of time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.