Polyamide resin composition
US8273431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2007 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Feb 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31757
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition contains a resin component containing at least a polyamide (X) and a fatty acid metallic salt having from 10 to 50 carbon atoms, and contains arbitrarily an additive (A) and/or an additive (B). The polyamide (X) is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid. The additive (A) is at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms, and a surfactant, and the additive (B) is at least one compound selected from the group consisting of a metallic hydroxide, a metallic acetate salt, a metallic alkoxide, a metallic carbonate salt and a fatty acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.