By-die-exposure for patterning of holes in edge die
US8273523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2006 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In accordance with the invention, there are semiconductor devices and methods of making semiconductor devices and holes. The method of making a semiconductor device can comprise forming a photoresist layer over a surface of a wafer, wherein the wafer comprises an edge that has a substantially rounded profile, an array of dies, and at least one edge die. The method can also comprise dividing a shot area into a plurality of shot portions and assigning a blind ID to each of the plurality of shot portions. The method can further comprise identifying one or more edge shot portions on the edge of the wafer for additional exposure; and exposing one or more times identified one or more edge shot portions on the edge of the wafer and blocking non-identified one or more non-edge shot portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.