Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate
US8273605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100, each having external electrodes formed on a pair of opposing surfaces. One 102 of the electrodes is arranged on an antenna circuit 201 in a transmission/reception antenna having a slit. Furthermore, a bridging plate 300 is arranged for separately and electrically connecting the other external electrode 103 to a predetermined position of the corresponding antenna circuit 301. The method is characterized in that by positioning at least one of the IC chips 100 with the predetermined position on the corresponding antenna circuit 201 to be mounted, it is possible to arrange the retraining IC chips 100 at the predetermined positions on the antenna circuit 201 all at once.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.