Semiconductor device and method of manufacturing the same
US8274166B2 · kind B2 · utility
1Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 7, 2009 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Jul 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate; an alignment mark formed on the substrate and composed of a metal film; a cover insulating film formed on the alignment mark and covering an entire surface of the alignment mark; and a polyimide film formed on the cover insulating film, and having an opening, which is opened on the alignment mark and has an end face aligning with an end face of the alignment mark, in plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.