Miniature camera module
US8274599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2008 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Aug 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Digital miniature cameras and methods to manufacture thereof have been achieved. Said miniature cameras having an adjustable focusing device are intended to be used as a built-in modules in hand-held consumer electronic devices, such as e.g. mobile phones and PDAs. The cameras invented have a very small size and produce high-quality pictures. Glue is used to hold different parts together and to seal the joints. The lens is glued in the final stage of the manufacturing line, thus providing the focus setting and the sealing of the cavity that covers the image sensor. A glob top is used to cover and seal the image processor. Said glob top serves two different purposes, first, to distribute the heat away from the sensor and, second, to lock the frame, together with the lens house, into a printed circuit board. In one embodiment a cavity PCB is used to “bury” the sensor of the camera, thus reducing the overall height required. In another embodiment the image processor is mounted on a flexistrip directly underneath the image sensor die, thus reducing the total height of the camera module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.