Thermal interposer liquid cooling system
US8274787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal interposer for a heat-generating electronic component includes a thermally conducting body that is configured to be thermally coupled to the electronic component. The thermally conducting body may include a first region that is located on a first face of the thermally conducting body. The first region may be adapted to be in thermal contact with a surface of the electronic component. The thermally conducting body may also include a second region located on a second face that is opposite the first face of the thermally conducting body. The thermal interposer may also include a cold plate assembly that is removably coupled to the thermally conducting body. The cold plate assembly may be in thermal contact with the second region of the thermally conducting body. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.