Magnetically coupled thin-wafer handling system
US8276262B2 · kind B2 · utility
2Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2008 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Aug 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.