Device and method for cutting off substrate of fragile material
US8276796B2 · kind B2 · utility
5Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2006 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Mar 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/325
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.