Compounds for placing objects by self assembling and the use thereof
US8277599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2006 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Jul 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/701
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The inventive method for placing and fixing (bonding) a first object, whose surface is functionalized by compounds of formula I Y (X), A′ (I), on the surface of a second object whose surface is functionalized by compounds of formula II Y (X)n A (II), wherein A and A′ are functional groups enabling to be bonded at least by a link in a covalent manner to an object surface X and X′ are aliphatic, linear, branched or cyclic spacers which can comprise one or several hetero or aromatic, or heteroaromatic atoms or consist of several aromatic or heteroaromatic cycles and optionally of alternating aliphatic chains having aromatic or heteroaromatic groups, n and n′=0 or 1 and Y and Y are functions for generating one or several non-covalent bonds wherein said Y or Y′ are selected such that they are complementary or can complex a metal atom or an identical metal compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.