Patent · US Active

Reactive hot melt adhesive

US8277601B2 · kind B2 · utility

1Cited by
7References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 12, 2008
Grant dateOct 2, 2012
Priority date—
Expiry dateJun 14, 2029

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2666/06
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Solvent free, moisture curable reactive hot melt adhesives are prepared using an oxazolidine functional prepolymer and a polyfunctional isocyanate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.