Material pattern, and mold, metal thin-film pattern, metal pattern using thereof, and methods of forming the same
US8278028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2008 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Mar 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a material pattern, and mold using thereof, metal thin-film pattern, metal pattern, and method of forming the sames. A method of forming the material pattern according to the present invention comprises the steps of; (a) forming a photo-sensitive material film by coating a photo-sensitive material on a substrate; (b) deciding an exposure section on the photo-sensitive material film; (c) disposing a light refraction film and a light diffusion film at a route of light exposed on the photo-sensitive material film; and (d) forming a pattern on the photo-sensitive material film, by projecting a light on the exposure section of the photo-sensitive material film, wherein the light transmits the light refraction film and the light diffusion film.A method of forming the material pattern according to the present invention can form the material pattern of three-dimensional asymmetric structure having various inclinations and shapes and can form simply mold, metal thin-film and metal pattern using thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.