Resin composition
US8278408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2009 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Jul 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a resin composition having an excellent balance between shortness of curing time and longness of pot life. The resin composition contains (A) an organopolysiloxane having an alkenyl group, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a hydrosilylation catalyst, (D) a silane coupling agent and (E) an unsaturated dicarboxylic acid ester. The component (B) contains (B-1) an organopolysiloxane having a molecular weight of not less than 5,000 but not more than 50,000 and (B-2) an organopolysiloxane having a molecular weight of not less than 100 but not more than 5,000, and the ratio of (B-2) to (B-1) is preferably not less than 0.01% by mass but not more than 20% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.