Apparatus for minimizing a heat affected zone during laser micro-machining
US8278590B2 · kind B2 · utility
5Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2005 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Jan 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/361
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention are directed to methods and systems for laser micro-machining, which may include dividing a long line illumination field into a plurality of individual fields, wherein each of the plurality of fields includes an aspect ratio of about 4:1 or greater, directing the plurality of individual fields onto at least one mask, wherein each individual field illuminates a corresponding area on the mask and translating the mask and/or workpiece relative to one another along a scan axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.