Optoelectronic component
US8278767B2 · kind B2 · utility
3Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2009 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8584
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.