Flexible circuit assemblies with stacked flex interconnects and connector assemblies having the same
US8279613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2010 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Dec 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flexible circuit assembly including a pair of mating panels. Each of the mating panels has an engagement face and a power contact. The circuit assembly also includes adjacent first and second flex interconnects that mechanically and electrically couple the mating panels. The first and second flex interconnects extend alongside each other and have respective interior surfaces. The first and second flex interconnects are stacked with respect to each other such that the interior surfaces face each other and define a heat-dissipating interspace therebetween. The circuit assembly also includes a plurality of power conductors that extend through the first and second flex interconnects between the mating panels. The power conductors are electrically parallel to one another between the power contacts. At least one of the power conductors extends proximate to the interior surface of one of the first and second flex interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.