Microcap acoustic transducer device
US8280080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2009 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Dec 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.