Patent · US Active

Method of producing a circuit board layer

US8281485B2 · kind B2 · utility

0Cited by

8References

15Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Peter Tauber · Rötteln, DE
Tuncay Sentuerk · Reutlingen, DE
Ulrich Speh · Steinenbronn, DE

Key dates

Filing date	Oct 13, 2008
Grant date	Oct 9, 2012
Priority date	—
Expiry date	Oct 13, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.