Ultrasonic acoustic emissions to detect substrate fracture
US8281661B2 · kind B2 · utility
2Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2010 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0258
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of detecting a fracture as it occurs in a component during a manufacturing process includes positioning an acoustic sensor in acoustic communication with the component. A manufacturing process is performed while the acoustic sensor remains in acoustic communication with the component. A signal indicative of acoustic emissions from the component during the manufacturing process is provided to a controller where it is determined whether the component has fractured based on the signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.