Nanoimprint resist, nanoimprint mold and nanoimprint lithography
US8282381B1 · kind B1 · utility
8Cited by
0References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 30, 2012 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Apr 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A nanoimprint mold includes a flexible body and a molding layer formed on the flexible body. The molding layer includes a plurality of protrusions and recesses. The molding layer is a polymer material polymerized via a cross linking polymerization of a nanoimprint resist which includes a hyperbranched polyurethane oligomer (HP), a perfluoropolyether (PFPE), a methylmethacrylate (MMA), a diluent solvent and a photo initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.