Method for improving mechanical strength of bondings made with an adhesive based on curable resin by chain polymerization
US8282764B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 10, 2007 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Oct 21, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to a process that makes it possible to improve the mechanical strength of bonds between substrates when these bonds are produced by means of an adhesive that comprises a resin that can be cured by chain polymerization, and in particular a resin that can be cured under the effect of ionizing or light radiation.This process is characterized in that it comprises the grafting of groups capable of acting as chain transfer agents during the polymerization of said resin to the surface of the substrates, before the latter are brought into contact with the adhesive.Applications: assembling of structural, engine, passenger compartment or bodywork parts in the aeronautical, space, railway, ship-building and automotive industries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.