Manufacturing process for solid state lighting device on a conductive substrate
US8283676B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2010 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Mar 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
Abstract
A method for fabricating a light emitting device includes forming a trench in a first surface on a first side of a substrate. The trench comprises a first sloped surface not parallel to the first surface, wherein the substrate has a second side opposite to the first side of the substrate. The method also includes forming light emission layers over the first trench surface and the first surface, wherein the light emission layer is configured to emit light and removing at least a portion of the substrate from the second side of the substrate to form a protrusion on the second side of the substrate to allow the light emission layer to emit light out of the protrusion on the second side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.