Chip-bonding light emitting diode chip
US8283683B2 · kind B2 · utility
7Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2009 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Dec 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.