Power semiconductor module and fabrication method thereof
US8283763B2 · kind B2 · utility
1Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2007 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Oct 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10318
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.