Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
US8283783B2 · kind B2 · utility
5Cited by
2References
27Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Sep 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.